Open AccessA FLUSH-MOUNT SENSOR PACKAGE FOR A MEMS PIEZOELECTRIC MICROPHONE WITH THROUGH-SILICON-VIAS FOR AIRCRAFT FUSELAGE ARRAYS
Author(s) -
Tiffany N. Reagan,
James R. Underbrink,
Jessica Meloy,
Mark Sheplak
Publication year - 2016
Publication title -
2016 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2016.36
Subject(s) - fuselage , microelectromechanical systems , microphone , acoustics , materials science , silicon , piezoelectricity , surface mount technology , electrical engineering , electronic engineering , engineering , optoelectronics , aerospace engineering , printed circuit board , loudspeaker , physics