Open AccessA FLUSH-MOUNT SENSOR PACKAGE FOR A MEMS PIEZOELECTRIC MICROPHONE WITH THROUGH-SILICON-VIAS FOR AIRCRAFT FUSELAGE ARRAYS
Author(s) -
Tiffany N. Reagan,
James R. Underbrink,
Jessica Meloy,
Mark Sheplak
Publication year - 2016
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2016.36
Subject(s) - microelectromechanical systems , microphone , fuselage , acoustics , fabrication , piezoelectricity , materials science , sensitivity (control systems) , piezoelectric sensor , electronic engineering , engineering , optoelectronics , aerospace engineering , sound pressure , physics , medicine , alternative medicine , pathology
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