Open AccessFLIP-CHIP BASED PACKAGING FOR LINEAR RATCHETING MICROACTUATORS ENABLES 3D STACKS OF MOVEBLE MICROELECTRODES FOR THE BRAIN
Author(s) -
Jemmy Sutanto,
Sindhu Anand,
R. Korb,
Liqin Zhou,
Michael Baker,
Murat Okandan,
Jit Muthuswamy
Publication year - 2012
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2012.42
Subject(s) - microelectrode , flip chip , materials science , 3d printing , chip , optoelectronics , computer science , nanotechnology , biomedical engineering , electrode , engineering , composite material , physics , adhesive , layer (electronics) , quantum mechanics , telecommunications