FLIP-CHIP BASED PACKAGING FOR LINEAR RATCHETING MICROACTUATORS ENABLES 3D STACKS OF MOVEBLE MICROELECTRODES FOR THE BRAIN | Zendy

Jemmy Sutanto | Zendy; Sindhu Anand | Zendy; R. W. Korb | Zendy; Li Zhou | Zendy; Michael Baker | Zendy; Murat Okandan | Zendy; Jit Muthuswamy | Zendy

Open Access

FLIP-CHIP BASED PACKAGING FOR LINEAR RATCHETING MICROACTUATORS ENABLES 3D STACKS OF MOVEBLE MICROELECTRODES FOR THE BRAIN

Author(s) -

Jemmy Sutanto,

Sindhu Anand,

R. W. Korb,

Li Zhou,

Michael Baker,

Murat Okandan,

Jit Muthuswamy

Publication year - 2012

Publication title -

1998 solid-state, actuators, and microsystems workshop technical digest

Language(s) - English

Resource type - Conference proceedings

DOI - 10.31438/trf.hh2012.42

Subject(s) - microelectrode , flip chip , interconnection , microelectromechanical systems , materials science , chip , integrated circuit packaging , scalability , system in package , electronic packaging , chip scale package , optoelectronics , electronic engineering , computer science , electrical engineering , integrated circuit , nanotechnology , electrode , engineering , chemistry , telecommunications , adhesive , layer (electronics) , composite material , database

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