Open AccessULTRA-MINIATURIZED POWER CONVERTER MODULES USING MICROMACHINED COPPER SCAFFOLDS
Author(s) -
Christopher Meyer,
Sarah S. Bedair,
Brian Morgan,
David P. Arnold
Publication year - 2012
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2012.32
Subject(s) - materials science , copper plating , wafer , electroplating , copper , surface micromachining , fabrication , etching (microfabrication) , optoelectronics , photoresist , soldering , layer (electronics) , interposer , nanotechnology , composite material , metallurgy , medicine , alternative medicine , pathology
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