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USING DRIE SILICON AS A CUTTING TOOL FOR HIGH PRECISION MICROMACHINING OF METAL ALLOYS
Author(s) -
T. Li,
Qingshun Bai,
Yogesh B. Gianchandani
Publication year - 2012
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2012.126
Subject(s) - surface micromachining , silicon , deep reactive ion etching , materials science , bulk micromachining , metal , etching (microfabrication) , metallurgy , optoelectronics , nanotechnology , fabrication , reactive ion etching , medicine , alternative medicine , pathology , layer (electronics)

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