Open AccessUSING DRIE SILICON AS A CUTTING TOOL FOR HIGH PRECISION MICROMACHINING OF METAL ALLOYS
Author(s) -
T. Li,
Qingshun Bai,
Yogesh B. Gianchandani
Publication year - 2012
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2012.126
Subject(s) - deep reactive ion etching , surface micromachining , materials science , liga , microelectromechanical systems , machining , electrical discharge machining , electroplating , silicon , etching (microfabrication) , electrode , microfabrication , metallurgy , optoelectronics , reactive ion etching , nanotechnology , fabrication , medicine , alternative medicine , layer (electronics) , pathology , chemistry
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