Open AccessA NEW EXTRINSIC GETTERING TECHNIQUE IN THICK BONDED SILICON-ON-INSULATOR WAFERS ENABLING SENSOR-IC INTEGRATION
Author(s) -
P.M. Sandow,
S. Whiston,
Paul Daly,
Jari Mäkinen,
Jouko Hintsala,
K. Nunan,
William D. Sawyer
Publication year - 2008
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2008.53
Subject(s) - wafer , materials science , silicon on insulator , getter , wafer bonding , optoelectronics , silicon , layer (electronics) , oxide , etching (microfabrication) , fabrication , microelectromechanical systems , residual stress , composite material , metallurgy , medicine , alternative medicine , pathology
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