Open AccessA NEW EXTRINSIC GETTERING TECHNIQUE IN THICK BONDED SILICON-ON-INSULATOR WAFERS ENABLING SENSOR-IC INTEGRATION
Author(s) -
P.M. Sandow,
S. Whiston,
Paul Daly,
Jari Mäkinen,
Jouko Hintsala,
K. Nunan,
William D. Sawyer
Publication year - 2008
Publication title -
2008 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2008.53
Subject(s) - wafer , getter , silicon on insulator , materials science , optoelectronics , silicon , wafer scale integration , wafer bonding , insulator (electricity) , electronic engineering , engineering