Open AccessSILICON-ON-SILICON (SOS): A NEW CMOS COMPATIBLE LOW-TEMPERATURE MEMS PROCESS USING PLASMA ACTIVATED FUSION BONDING
Author(s) -
T. Galchev,
Warren C. Welch,
K. Najafi
Publication year - 2006
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2006.26
Subject(s) - silicon on insulator , materials science , silicon , microelectromechanical systems , wafer , wafer bonding , optoelectronics , fabrication , direct bonding , anodic bonding , hybrid silicon laser , layer (electronics) , electronic engineering , nanotechnology , engineering , medicine , alternative medicine , pathology
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