Open AccessSelective and Localized Bonding using Induction Heating
Author(s) -
Anyuan Cao,
Mu Chiao,
Liwei Lin
Publication year - 2002
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2002.39
Subject(s) - anodic bonding , materials science , fabrication , composite material , soldering , polycarbonate , microelectromechanical systems , wire bonding , thermocompression bonding , polymer , induction heating , nanotechnology , layer (electronics) , chip , electrical engineering , electromagnetic coil , engineering , medicine , alternative medicine , pathology
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