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Wafer Level Anti-Stiction Coatings with Superior Thermal Stability
Author(s) -
W. Robert Ashurst,
Carlo Carraro,
Roya Maboudian,
W. Frey
Publication year - 2002
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2002.36
Subject(s) - stiction , wafer , thermal stability , materials science , wafer scale integration , thermal , optoelectronics , microelectromechanical systems , engineering , physics , thermodynamics , chemical engineering

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