Open AccessA Robust Gold-Silicon Eutectic Wafer Bonding Technology for Vacuum Packaging
Author(s) -
Yong Mei,
G.R. Laniji,
K. Najafi
Publication year - 2002
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2002.22
Subject(s) - eutectic bonding , eutectic system , wafer , materials science , silicon , wafer bonding , optoelectronics , vacuum packing , electronic packaging , wafer level packaging , metallurgy , mechanical engineering , composite material , engineering , alloy