Open AccessA Robust Gold-Silicon Eutectic Wafer Bonding Technology for Vacuum Packaging
Author(s) -
Yong Mei,
G.R. Laniji,
K. Najafi
Publication year - 2002
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2002.22
Subject(s) - wafer , materials science , eutectic bonding , eutectic system , wafer bonding , microelectromechanical systems , silicon , optoelectronics , diaphragm (acoustics) , yield (engineering) , composite material , electroplating , layer (electronics) , electrical engineering , alloy , engineering , loudspeaker
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