Open AccessA Wafer-Level Vacuum Packaging Process by RTP Aluminum-to-Nitride Bonding
Author(s) -
Mu Chiao,
Liwei Lin
Publication year - 2002
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2002.21
Subject(s) - materials science , wafer , wafer level packaging , nitride , vacuum level , resonator , optoelectronics , electronic packaging , microelectromechanical systems , aluminium , durability , vacuum deposition , deposition (geology) , composite material , physics , quantum mechanics , paleontology , sediment , biology , layer (electronics)
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