Open AccessA Wafer-Level Vacuum Packaging Process by RTP Aluminum-to-Nitride Bonding
Author(s) -
Mu Chiao,
Lin Liu
Publication year - 2002
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2002.21
Subject(s) - wafer , materials science , nitride , aluminium , wafer bonding , vacuum packing , electronic packaging , vacuum level , optoelectronics , process (computing) , metallurgy , composite material , computer science , mechanical engineering , engineering , layer (electronics) , physics , quantum mechanics , operating system