Open Access100% Foundry Compatble Packaging and Full Wafer Release/DIE Separation Technique for Surface Micromachined Devices
Author(s) -
Andrew Oliver,
Cosin Alvarez M
Publication year - 2000
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000a.3
Subject(s) - wafer , materials science , die (integrated circuit) , die preparation , chip scale package , surface micromachining , foundry , wafer bonding , mold , optoelectronics , wafer testing , composite material , fabrication , wafer dicing , nanotechnology , metallurgy , medicine , alternative medicine , pathology
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