Open Access100% Foundry Compatble Packaging and Full Wafer Release/DIE Separation Technique for Surface Micromachined Devices
Author(s) -
Andrew Oliver,
Carolyn M. Matzke
Publication year - 2000
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000a.3
Subject(s) - die (integrated circuit) , wafer , foundry , die preparation , materials science , surface micromachining , wafer bonding , wafer scale integration , integrated circuit packaging , optoelectronics , wafer dicing , metallurgy , nanotechnology , integrated circuit , fabrication , medicine , alternative medicine , pathology