Open AccessResidual Stress Characterization of Thick PECVD TEOS Film for Power MEMS Applications
Author(s) -
X. Zhang,
Reza Ghodssi,
K.-S. Chen,
Arturo A. Ayón,
S.M. Spearing
Publication year - 2000
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000.77
Subject(s) - residual stress , materials science , plasma enhanced chemical vapor deposition , wafer , characterization (materials science) , microelectromechanical systems , oxide , stress (linguistics) , cracking , composite material , residual , optoelectronics , chemical vapor deposition , nanotechnology , computer science , metallurgy , linguistics , philosophy , algorithm
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom