Open AccessResidual Stress Characterization of Thick PECVD TEOS Film for Power MEMS Applications
Author(s) -
X. Zhang,
Reza Ghodssi,
K.-S. Chen,
Arturo A. Ayón,
S.M. Spearing
Publication year - 2000
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000.77
Subject(s) - residual stress , plasma enhanced chemical vapor deposition , materials science , microelectromechanical systems , stress (linguistics) , characterization (materials science) , residual , electronic engineering , optoelectronics , composite material , computer science , nanotechnology , chemical vapor deposition , engineering , linguistics , philosophy , algorithm