Open AccessTemperature Coefficients of Material Properties Using Differential Capacitive Strain Sensors
Author(s) -
L.L. Chu,
Liru Que,
Yogesh B. Gianchandani
Publication year - 2000
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000.76
Subject(s) - thermal expansion , materials science , capacitive sensing , composite material , residual stress , temperature coefficient , young's modulus , modulus , fabrication , ultimate tensile strength , strain (injury) , electrical engineering , medicine , engineering , alternative medicine , pathology
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