Open AccessDevelopment of a Wafer-Bonded, Silicon-Nitride Membrane Thermal Shear-Stress Sensor with Platinum Sensing Element
Author(s) -
Anthony Cain,
V. Chandrasekaran,
Toshirou Nishida,
Mark Sheplak
Publication year - 2000
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000.73
Subject(s) - wafer , materials science , silicon nitride , composite material , silicon , optoelectronics , membrane , stress (linguistics) , shear stress , wafer bonding , platinum , chemistry , biochemistry , linguistics , philosophy , catalysis