Open AccessDevelopment of a Wafer-Bonded, Silicon-Nitride Membrane Thermal Shear-Stress Sensor with Platinum Sensing Element
Author(s) -
Anthony Cain,
Vijayvenkatesh Chandrasekaran,
Toshirou Nishida,
Mark Sheplak
Publication year - 2000
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh2000.73
Subject(s) - materials science , wafer , silicon nitride , silicon , thermal oxidation , stress (linguistics) , optoelectronics , pressure sensor , platinum , shear stress , composite material , calibration , wafer bonding , mechanical engineering , chemistry , linguistics , philosophy , biochemistry , catalysis , statistics , mathematics , engineering
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom