Open AccessAn On-Chip Hermetic Packaging Technology for Micromechanical Devices
Author(s) -
S.T. Cho,
F. M. Erdmann
Publication year - 1998
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1998.51
Subject(s) - materials science , eutectic system , eutectic bonding , electronic packaging , chemical mechanical planarization , thermal shock , layer (electronics) , optoelectronics , seal (emblem) , wafer bonding , amorphous solid , microelectronics , chip , interposer , wafer , composite material , electrical engineering , microstructure , etching (microfabrication) , engineering , art , visual arts , chemistry , organic chemistry
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