Open AccessAn On-Chip Hermetic Packaging Technology for Micromechanical Devices
Author(s) -
S.T. Cho,
F. M. Erdmann
Publication year - 1998
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1998.51
Subject(s) - electronic packaging , chip , chip scale package , integrated circuit packaging , system in package , materials science , electrical engineering , computer science , electronic engineering , engineering