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Post-Packaging Release a New Concept for Surface-Micromachined Devices
Author(s) -
Balaji Sridharan,
C.-J. Kim,
Long-Sun Huang
Publication year - 1998
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1998.50
Subject(s) - sublimation (psychology) , materials science , packaging engineering , microelectromechanical systems , electronic packaging , surface micromachining , vapor phase , silicon , optoelectronics , nanotechnology , mechanical engineering , composite material , engineering , fabrication , medicine , alternative medicine , pathology , psychology , physics , psychotherapist , thermodynamics

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