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Fabrication of High-Density Cantilever Arrays and Thorough-Wafer Interconnects
Author(s) -
Eugene M. Chow,
H. Tom Soh,
Aaron Partridge,
Thomas W. Kenny,
S. Abdollahi-Alibeik,
J.P. McVittie,
Aongus McCarthy,
S.F. Quate
Publication year - 1998
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1998.49
Subject(s) - fabrication , wafer , cantilever , wafer fabrication , wafer scale integration , materials science , optoelectronics , die preparation , wafer testing , nanotechnology , electronic engineering , engineering , composite material , wafer dicing , medicine , alternative medicine , pathology

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