Open AccessDevelopment of an Innovative Flip-Chip Bonding Technique Using Micromachined Condcutive Polymer Bumps
Author(s) -
Kwang W. Oh,
Chong H. Ahn
Publication year - 1998
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1998.37
Subject(s) - flip chip , materials science , surface micromachining , polymer , chip , electronic engineering , optoelectronics , composite material , fabrication , engineering , electrical engineering , adhesive , layer (electronics) , medicine , alternative medicine , pathology