Open AccessDevelopment of an Innovative Flip-Chip Bonding Technique Using Micromachined Condcutive Polymer Bumps
Author(s) -
Kwang W. Oh,
Chong H. Ahn
Publication year - 1998
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1998.37
Subject(s) - flip chip , bumping , materials science , surface micromachining , microelectromechanical systems , optoelectronics , wire bonding , photolithography , electrical conductor , polymer , contact resistance , nanotechnology , chip , adhesive , composite material , fabrication , electrical engineering , mechanical engineering , medicine , alternative medicine , layer (electronics) , pathology , engineering
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom