Open AccessAn Integrated Accelerometer as a Demostration of a New Technology Using Silicon Fusion Bonding and Deep Ractive-Ion Etching
Author(s) -
N.I. Maluf,
Jaidah Mohan,
K. Petersen,
G.T.A. Kovacs
Publication year - 1996
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1996a.11
Subject(s) - deep reactive ion etching , materials science , accelerometer , etching (microfabrication) , optoelectronics , capacitance , silicon , capacitive sensing , fusion , cmos , sensitivity (control systems) , reactive ion etching , electronic engineering , electrical engineering , nanotechnology , computer science , engineering , chemistry , layer (electronics) , electrode , linguistics , philosophy , operating system
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