Open AccessWafer-To-Wafer Transfer of Microsturctures for Vacuum Packaging
Author(s) -
Michael B. Cohn,
Yu Liang,
Roger T. Howe,
Albert P. Pisano
Publication year - 1996
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1996.8
Subject(s) - wafer , wafer scale integration , die preparation , wafer level packaging , materials science , vacuum packing , wafer testing , optoelectronics , transfer (computing) , computer science , mechanical engineering , wafer dicing , engineering , parallel computing