Open AccessWafer-To-Wafer Transfer of Microsturctures for Vacuum Packaging
Author(s) -
Michael B. Cohn,
Yu Liang,
Roger T. Howe,
Albert P. Pisano
Publication year - 1996
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1996.8
Subject(s) - wafer , wafer bonding , materials science , wafer scale integration , wafer level packaging , optoelectronics , die preparation , eutectic system , fabrication , transfer (computing) , wafer backgrinding , electronic circuit , eutectic bonding , integrated circuit , computer science , electrical engineering , engineering , wafer dicing , composite material , alloy , parallel computing , medicine , alternative medicine , pathology
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