A High-Yield Process for Three-Dimensional Microelectrode Arrays
Author(s) -
Qingshun Bai,
Arthur D. Kuo
Publication year - 1996
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - English
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1996.59
Subject(s) - microelectrode , materials science , silicon , crosstalk , wire bonding , multielectrode array , electrode , surface micromachining , lithography , chip , optoelectronics , electronic engineering , nanotechnology , electrical engineering , fabrication , engineering , physics , quantum mechanics , medicine , alternative medicine , pathology
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