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THERMAL MANAGEMENT OF INTEGRATED MICROSENSORS
Author(s) -
S. B. Crary
Publication year - 1986
Publication title -
1998 solid-state, actuators, and microsystems workshop technical digest
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.31438/trf.hh1986.16
Subject(s) - thermal conduction , heat transfer , heat sink , convective heat transfer , finite element method , materials science , thermal , thermal management of electronic devices and systems , convection , diaphragm (acoustics) , boundary layer , boundary value problem , mechanics , mechanical engineering , electronic engineering , acoustics , engineering , thermodynamics , physics , composite material , vibration , quantum mechanics

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