Open AccessExperimental and Numerical Analysis of Electronics Heat Sink
Author(s) -
Ahmad Faris Ismail,
Mohamud Ahmed Musse,
Yousif Abdalla Abakr
Publication year - 1970
Publication title -
iium engineering journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.141
H-Index - 6
eISSN - 2289-7860
pISSN - 1511-788X
DOI - 10.31436/iiumej.v3i2.362
Subject(s) - computational fluid dynamics , heat sink , software , electronics , work (physics) , electronics cooling , mechanical engineering , thermal , engineering , simulation , computer science , aerospace engineering , electrical engineering , thermodynamics , physics , programming language
Cooling of electronic components continues to attract many research and development activities towards achieving an effective way of cooling. Computational fluid dynamics (CFD) tools may be considered as a cheap substitute for expensive experimental testing methods. In this work the cooling of a simulated electronic board was modeled using FLUENTTM CFD software, and experimental procedures were followed to validate the estimated results, and to understand the factors that would affect the software capability to predict the actual measured values. Results showed good agreement between the simulation and experimental results. The software was found to be capable to predict the exact values at the locations where the temperature values were similar to the board mean temperature. The maximum percentage error was found to be limited to 4.7%, and the capability of the software to estimate the exact measured values was found to be affected by the function of thermal wake generation.
Keywords: CFD, Electronic cooling, Heat sink, Simulation