Open AccessFlip-Chip and Backside Techniques
Author(s) -
Edward I. Cole,
Kira L. Fishgrab,
Daniel L. Barton,
Karoline Bernhard-Höfer
Publication year - 2021
Publication title -
proceedings - international symposium for testing and failure analysis
Language(s) - English
Resource type - Conference proceedings
ISSN - 0890-1740
DOI - 10.31399/asm.cp.istfa2021tpg1
Subject(s) - polishing , materials science , etching (microfabrication) , grinding , wafer , flip chip , reactive ion etching , die (integrated circuit) , focused ion beam , optoelectronics , ion milling machine , silicon , chip , nanotechnology , ion , engineering , electrical engineering , metallurgy , chemistry , layer (electronics) , adhesive , organic chemistry
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