Open AccessYield improvement in chemical mechanical planarization via material removal variation on a surface
Author(s) -
Muthukkumar Kadavasal Sivaraman
Publication year - 2020
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.31274/rtd-20200616-20
Subject(s) - chemical mechanical planarization , wafer , die (integrated circuit) , mechanical engineering , materials science , scale (ratio) , engineering , semiconductor device fabrication , planarity testing , engineering drawing , computer science , mathematics , nanotechnology , physics , polishing , quantum mechanics , combinatorics