
Use of mutual inductance techniques to measure thermal expansion at low temperatures
Author(s) -
R. H. Carr
Publication year - 2018
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.31274/rtd-180814-677
Subject(s) - measure (data warehouse) , inductance , thermal expansion , thermal , materials science , electrical engineering , computer science , physics , thermodynamics , engineering , data mining , voltage