Low temperature thermal expansion of copper, silver, gold and aluminum | Zendy

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Low temperature thermal expansion of copper, silver, gold and aluminum

Author(s) -

Kent Otho McLean

Publication year - 2018

Language(s) - English

Resource type - Dissertations/theses

DOI - 10.31274/rtd-180813-406

Subject(s) - copper , thermal expansion , aluminium , materials science , metallurgy , gold alloys , alloy

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