Open AccessDesign and simulation of an out-of-plane electrothermal microactuator
Author(s) -
Ngoc Bich Duong Pham Van Men Truong
Publication year - 2020
Publication title -
tạp chí khoa học và công nghệ
Language(s) - English
Resource type - Journals
ISSN - 1859-1531
DOI - 10.31130/jst-ud2020-086e
Subject(s) - microactuator , microelectromechanical systems , deflection (physics) , actuator , materials science , beam (structure) , finite element method , mechanical engineering , structural engineering , joule heating , engineering , optics , optoelectronics , physics , composite material , electrical engineering
Microactuators are one of the most important components in microelectromechanical systems (MEMS). Therefore, designing effective out-of-plane actuators has been in progress for the last decade. This paper presents a novel design of the microactuator with a double stepped beam structure for large out-of-plane deflection output applied to microvalves. The design and analysis of the out-of-plane microactuator are implemented by the finite element method. Silicon is selected as the material of the actuator and the beam motion is generated by the Joule heating effect. Compared to a single stepped beam design reported in the literature, the simulation results show that the proposed double-stepped beam structure can deliver a much larger out-of-plane deflection. Under an applied current of 15 mA, the maximum deflection of the double stepped beam is nearly seven times higher than that of the single stepped beam structure. In addition, the stress analysis indicates that the largest stress (1.46 GPa) induced in the beam is much smaller than the yield strength (7 GPa) of the selected silicon material.