Open AccessExpansion of SPICE Simulation Tools Abilities by Taking into Account MOS Circuits Aging Effects Caused by Hot Carriers, Gate Dielectric Breakdown and Electromigration
Author(s) -
I. A. Kharitonov
Publication year - 2021
Publication title -
problemy razrabotki perspektivnyh mikro- i nanoèlektronnyh sistem ...
Language(s) - English
Resource type - Journals
ISSN - 2078-7707
DOI - 10.31114/2078-7707-2021-4-73-80
Subject(s) - spice , electromigration , materials science , time dependent gate oxide breakdown , dielectric , electronic engineering , dielectric strength , optoelectronics , gate dielectric , engineering physics , electrical engineering , engineering , voltage , transistor , composite material