Open AccessAnalytical Solutions of a Conduction Problem with Two Different Kinds of Boundary Conditions
Author(s) -
Zhongzhi Fu
Publication year - 2018
Publication title -
advancements in civil engineering and technology
Language(s) - English
Resource type - Journals
ISSN - 2639-0574
DOI - 10.31031/acet.2018.02.000532
Subject(s) - thermal conduction , reliability (semiconductor) , boundary value problem , separation of variables , mathematics , simple (philosophy) , partial differential equation , numerical analysis , distribution (mathematics) , boundary (topology) , heat transfer , mathematical analysis , thermodynamics , physics , power (physics) , philosophy , epistemology
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