Open AccessMechanical Integrity of Printed Circuit Heat Exchanger
Author(s) -
Ali Aljelawy,
Aamer Aldabbagh,
Falah Hatem
Publication year - 2022
Publication title -
maǧallaẗ al-handasaẗ/journal of engineering
Language(s) - English
Resource type - Journals
eISSN - 2520-3339
pISSN - 1726-4073
DOI - 10.31026/j.eng.2022.08.05
Subject(s) - ultimate tensile strength , materials science , heat exchanger , composite material , copper , bond strength , diffusion bonding , yield (engineering) , compressive strength , bar (unit) , metallurgy , layer (electronics) , mechanical engineering , adhesive , physics , meteorology , engineering