Open AccessStudy of Lead-Free Solder Joint Reliability
Author(s) -
Hana Mutialif Maulidiah,
Budiana Budiana,
Widya Rika Puspita,
Adlian Jefiza,
Mustanir Mustanir
Publication year - 2022
Publication title -
jurnal integrasi
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2548-9828
pISSN - 2085-3858
DOI - 10.30871/ji.v14i1.3910
Subject(s) - soldering , lead (geology) , materials science , tin , electronics , reliability (semiconductor) , joint (building) , manufacturing engineering , metallurgy , engineering , architectural engineering , power (physics) , physics , quantum mechanics , geomorphology , electrical engineering , geology
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