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Effect of Aging Time on Deformation Behavior of Lead-Free and Lead Base Solders Alloys
Author(s) -
Alaa E. Ali
Publication year - 2018
Publication title -
engineering and technology journal
Language(s) - English
Resource type - Journals
eISSN - 2412-0758
pISSN - 1681-6900
DOI - 10.30684/etj.36.8a.4
Subject(s) - materials science , tin , lead (geology) , soldering , metallurgy , microstructure , deformation (meteorology) , anisotropy , compression (physics) , composite material , geology , geomorphology , physics , quantum mechanics

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