Open AccessSignal and Power Integrity Challenges for High Density System-on-Package
Author(s) -
Nathan Totorica,
Feng Li
Publication year - 2022
Publication title -
semiconductor science and information devices
Language(s) - English
Resource type - Journals
ISSN - 2661-3212
DOI - 10.30564/ssid.v4i2.4475
Subject(s) - miniaturization , power integrity , reliability (semiconductor) , signal integrity , electronic systems , system in package , computer science , electronic packaging , signal (programming language) , reliability engineering , power (physics) , electrical engineering , electronic engineering , embedded system , telecommunications , engineering , printed circuit board , chip , physics , quantum mechanics , programming language