Open AccessDisplacement Analysis of the MEMS Device
Author(s) -
İshak Ertugrul
Publication year - 2020
Publication title -
metallurgical and materials engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.161
H-Index - 2
eISSN - 2812-9105
pISSN - 2217-8961
DOI - 10.30544/504
Subject(s) - microelectromechanical systems , materials science , displacement (psychology) , voltage , thermal conductivity , thermal expansion , current (fluid) , composite material , optoelectronics , electrical engineering , psychology , psychotherapist , engineering
In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.