Open AccessThe Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates
Publication year - 2019
Publication title -
welding journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.27
H-Index - 71
eISSN - 2689-0445
pISSN - 0043-2296
DOI - 10.29391/2019.98.001
Subject(s) - soldering , materials science , ceramic , joint (building) , metallurgy , brazing , wetting , microstructure , composite material , ultimate tensile strength , layer (electronics) , solder paste , alloy , structural engineering , engineering
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