Open AccessMulti-Chip Module (MCM-D) Using Thin Film Technology
Author(s) -
Cristina B. Adamo,
Alexander Flacker,
Wilson Freitas,
Ricardo Cotrin Teixeira,
Michele O. da Silva,
Antonio Rotondaro
Publication year - 2020
Publication title -
jics. journal of integrated circuits and systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.125
H-Index - 11
eISSN - 1872-0234
pISSN - 1807-1953
DOI - 10.29292/jics.v10i1.401
Subject(s) - benzocyclobutene , materials science , photolithography , etching (microfabrication) , dielectric , deposition (geology) , silicon , optoelectronics , thin film , chip , lithography , reactive ion etching , nanotechnology , electrical engineering , layer (electronics) , engineering , paleontology , sediment , biology
Multi-chip Module (MCM) is a technology that can be applied to silicon and alumina modules allowing advantages in the integration complexity. This paper reports a MCM-D (D for deposition) technology suitable to fabricate passive components using two metal levels and non-photosensitive polymer benzocyclobutene as dielectric. The devices are produced using thin film technology, vacuum metallization, electroless and electrolytic deposition, photolithography process and wet etching. Electrical measurements and focused ion beam (FIB) were used to evaluate the characteristics of the MCM-D structures.