FUNDAMENTALLY NEW APPROACHES TO SOLVING THERMOPHYSICAL PROBLEMS IN THE FIELD OF NANOELECTRONICS
Author(s) -
V. I. Khvesyuk,
A. S. Barinov,
B. Liu,
Wenqiang Qiao
Publication year - 2021
Language(s) - English
Resource type - Conference proceedings
DOI - 10.29003/m2481.mmmsec-2021/92-94
Subject(s) - nanoelectronics , thermal conductivity , heat transfer , field (mathematics) , thermal , thermal resistance , materials science , contact resistance , interfacial thermal resistance , thermal management of electronic devices and systems , conductivity , computer science , engineering physics , nanotechnology , physics , thermodynamics , mechanical engineering , engineering , mathematics , pure mathematics , layer (electronics) , quantum mechanics
The paper discusses current problems related to the heat transfer in solid-state nanostructures: the influence of real rough boundaries on the effective thermal conductivity and contact thermal resistance
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