Open AccessFORMATION OF DIFFUSION BARRIERS IN THE COPPER METALLIZATION SYSTEM IN THE GAP FILLING METHOD
Author(s) -
А. М. Орлов,
Askar Rezvanov,
V. D. Gvozdev,
П. А. Кузнецов
Publication year - 2020
Publication title -
international forum “microelectronics – 2020”. joung scientists scholarship “microelectronics – 2020”. xiii international conference «silicon – 2020». xii young scientists scholarship for silicon nanostructures and devices physics, material science, process and analysis
Language(s) - English
Resource type - Conference proceedings
DOI - 10.29003/m1580.silicon-2020/136-138
Subject(s) - copper , materials science , diffusion , diffusion barrier , engineering physics , optoelectronics , metallurgy , composite material , engineering , thermodynamics , physics , layer (electronics)