Open AccessResearch on Reliability of Packaging Materials for PVT Modules
Author(s) -
Guo Ru,
AUTHOR_ID
Publication year - 2020
Publication title -
advances in material science
Language(s) - English
Resource type - Journals
ISSN - 2424-841X
DOI - 10.26789/ams.2020.01.005
Subject(s) - adhesive , materials science , electrical conductor , composite material , thermal conductivity , substrate (aquarium) , thermal , adhesion , glass fiber , polymer , oceanography , physics , layer (electronics) , meteorology , geology
This paper studies the difference in heat transfer and adhesion performance of glass fiber substrate thermal conductive double-sided adhesive, PVC substrate double-sided adhesive, and PET substrate double-sided adhesive to thermal conductive materials and polymer materials in photovoltaic and thermal integrated modules. Studies have shown that the use of glass fiber-based thermally conductive double-sided adhesive to bond polymer materials and thermally conductive materials can achieve the normal use of PVT modules under weather-resistant conditions. Research has shown that glass fiber-based thermally conductive double-sided adhesive has better adhesion than other materials., Initial viscosity, static shear force, thermal conductivity, etc., can realize the normal use of PVT modules under weathering conditions.