Open AccessCharacterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition
Author(s) -
Erika Hodúlová,
Adriana Ramos,
Roman Koleňák,
Igor Kostolný,
Beáta Šimeková,
Ingrid Kovaříková
Publication year - 2019
Publication title -
przegląd spawalnictwa
Language(s) - English
Resource type - Journals
eISSN - 2449-7959
pISSN - 0033-2364
DOI - 10.26628/wtr.v91i9.1073
Subject(s) - soldering , materials science , intermetallic , bilayer , joint (building) , metallurgy , characterization (materials science) , composite material , shear strength (soil) , deposition (geology) , ultrasonic sensor , nanotechnology , architectural engineering , paleontology , environmental science , physics , alloy , membrane , sediment , biology , soil water , acoustics , soil science , engineering , genetics
The joining of Ti and Ni at low temperatures was analysed in this work. For joining pure Ti and Ni coins of 1.5 mm in thickness were used. Reactive multilayer thin films/foils with nanometric period (bilayer thickness), in particular Ni/Al multilayers, have been used to promote joining in two thickness of 28 and 55 nm. The ultrasonic soldering with SnAgTi active solder has been used for “hard-to-solder” material. The structural evaluation of soldered joint was studied by optical microscopy and EDX analysis. The structural analysis was focused to the creation of intermetallic layers in the joint interface. The mechanical properties of solder joints were tested by shear strength.