Open AccessANALYSIS OF TWO KINDS OF INJECTION MOLDS FOR MOBILE PHONE BACK COVER BASED ON MOLDFLOW
Author(s) -
Baofu Sun,
Cong Jiang,
HU Ming-jiang
Publication year - 2017
Publication title -
topics in intelligent computing and industry design
Language(s) - English
Resource type - Conference proceedings
ISSN - 2523-1731
DOI - 10.26480/wsmce.01.2017.34.36
Subject(s) - cover (algebra) , mobile phone , molding (decorative) , point (geometry) , process (computing) , computer science , electronic engineering , materials science , engineering , mechanical engineering , telecommunications , mathematics , geometry , operating system
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