Open AccessREMOVAL RATE SIMULATION OF COPPER ELECTROCHEMICAL MECHANICAL PLANARIZATION
Author(s) -
Yan-fei Bian,
Zhenxuan Wang,
Meng Cai,
Wang Ruofu,
Tian Jingqun
Publication year - 2017
Publication title -
topics in intelligent computing and industry design
Language(s) - Uncategorized
Resource type - Conference proceedings
ISSN - 2523-1731
DOI - 10.26480/icie.01.2017.139.141
Subject(s) - chemical mechanical planarization , copper , electrochemistry , materials science , metallurgy , computer science , electrode , polishing , chemistry