Open AccessThe Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach
Author(s) -
Shi Sha
Publication year - 2019
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.25148/etd.fidc004089
Subject(s) - heat sink , chip , thermal management of electronic devices and systems , three dimensional integrated circuit , computer cooling , thermal , transistor , computer science , energy consumption , dissipation , engineering , electronic engineering , mechanical engineering , electrical engineering , voltage , physics , meteorology , thermodynamics