Open AccessThe Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach
Author(s) -
Shi Sha
Publication year - 2018
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.25148/etd.fidc004089
Subject(s) - heat sink , chip , thermal management of electronic devices and systems , computer cooling , three dimensional integrated circuit , thermal , computer science , transistor , energy consumption , engineering , electronic engineering , mechanical engineering , electrical engineering , physics , voltage , meteorology
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