Open AccessEmbedded Heat Pipes in Cofired Ceramic Substrates for Enhanced Thermal Management of Electronics
Author(s) -
Marc A. Zampino
Publication year - 2017
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.25148/etd.fi08081553
Subject(s) - heat pipe , materials science , heat sink , microelectronics , ceramic , thermal resistance , electronics cooling , thermocouple , substrate (aquarium) , electronics , composite material , thermal , electronic component , heat transfer , heat spreader , mechanical engineering , optoelectronics , electrical engineering , engineering , mechanics , thermodynamics , oceanography , physics , geology