Open AccessElectroless and Electrolytic Plating of Photopolymerized Resin for Use in the Micro-Molding of Three-Dimensional Nickel Structures
Author(s) -
Kohki Mukai,
Toshiya Yoshimura,
Shinya Kitayama,
Shoji Maruo
Publication year - 2007
Publication title -
journal of photopolymer science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.266
H-Index - 38
eISSN - 1349-6336
pISSN - 0914-9244
DOI - 10.2494/photopolymer.2.285
Subject(s) - materials science , electroless nickel plating , electroless plating , plating (geology) , nickel , molding (decorative) , metallurgy , electrolyte , composite material , gold plating (software engineering) , photopolymer , polymer , electroplating , polymerization , electrode , chemistry , layer (electronics) , geophysics , geology , management , economics
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