Open AccessA Review of Palladium Coated Copper Wire Bonding for Automotive Device
Author(s) -
Kok-Tee Lau,
Tjprc
Publication year - 2020
Publication title -
international journal of mechanical and production engineering research and development
Language(s) - English
Resource type - Journals
eISSN - 2249-6890
pISSN - 2249-8001
DOI - 10.24247/ijmperdjun2020424
Subject(s) - palladium , wire bonding , copper , copper wire , automotive industry , materials science , metallurgy , engineering , electrical engineering , chemistry , aerospace engineering , catalysis , chip , biochemistry