Open AccessModel Reduction of CFD Simulation of Integrated Circuit Cooling of an Electronics Packaging Via KRYLOV Subspace System
Author(s) -
Dasari. Govardhan Dasari. Govardhan,
Tjprc
Publication year - 2018
Publication title -
international journal of mechanical and production engineering research and development
Language(s) - English
Resource type - Journals
eISSN - 2249-6890
pISSN - 2249-8001
DOI - 10.24247/ijmperdapr2018170
Subject(s) - krylov subspace , computational fluid dynamics , reduction (mathematics) , electronics , computer science , automotive engineering , engineering , electrical engineering , aerospace engineering , mathematics , iterative method , geometry , algorithm