
Model analysis of heat dissipation and heat transfer
Publication year - 2020
Publication title -
journal of environmental sciences, computer science and engineering and technology
Language(s) - English
Resource type - Journals
ISSN - 2278-179X
DOI - 10.24214/jecet.c.9.3.46772
Subject(s) - dissipation , heat transfer , thermal management of electronic devices and systems , mechanics , thermodynamics , materials science , physics , mechanical engineering , engineering