Open AccessA COMBINED MODEL OF HEAT TRANSFER SYSTEM STRUCTURALLY-FUNCTIONAL MODULES OF ELECTRONIC EQUIPMENT
Author(s) -
В.В. Киселев,
V.N. Oskolkov
Publication year - 2017
Publication title -
naučno-tehničeskij vestnik povolžʹâ
Language(s) - English
Resource type - Journals
ISSN - 2079-5920
DOI - 10.24153/2079-5920-2017-7-3-68-71
Subject(s) - heat transfer , transfer (computing) , computer science , electronic equipment , mechanical engineering , reliability engineering , engineering , thermodynamics , physics , computer hardware , parallel computing